Bug Labs BUGvonHippel solderpad
bug-labs-bugvonhippel / Gerber / readme.txt
Project Name: b2_mod_vonhippel Version: v1.1 8/8/2008 Design Engineer: Bob Pritchard Contact info: r.pritchard@encadis.com 1-732-706-2974 1-732-739-3006 4-layer, 0.062 thickness, 0.5oz copper top & bottom Silkscreen top only One controlled impedance 100-ohm differential pair on board: Netnames: USBDP, USBDN* trace width=4mil (0.1016mm), separation=6.5mil (0.1651mm), center-to-center = 2+6.5+2 = 10.5mil (0.2667mm) All other traces min size=6mil (0.1524mm) Spacing=6mil (0.1524) center-to-center = 3+6+3 = 12mil (0.3048) Smallest trace: 4mil (diff pair) Smallest spacing: 6mil Total no. holes: 334 Stackup: TOP L2_GND L3_PWR BOTTOM