Project Name: b2_mod_vonhippel
Version: v1.1  8/8/2008
Design Engineer: Bob Pritchard
Contact info: r.pritchard@encadis.com
1-732-706-2974
1-732-739-3006

4-layer, 0.062 thickness, 0.5oz copper top & bottom
Silkscreen top only

One controlled impedance 100-ohm differential pair on board:
Netnames: USBDP, USBDN*
trace width=4mil (0.1016mm), separation=6.5mil (0.1651mm),
center-to-center = 2+6.5+2 = 10.5mil (0.2667mm)

All other traces min size=6mil (0.1524mm)
Spacing=6mil (0.1524)
center-to-center = 3+6+3 = 12mil (0.3048)

Smallest trace: 4mil (diff pair)   Smallest spacing: 6mil
Total no. holes: 334


Stackup:
TOP
L2_GND
L3_PWR
BOTTOM